Answer:
For unfined package = 1.30 × 10^-3 W.
Dor fined package = 8.64 × 10^-3 W.
Explanation:
STEP ONE: The first thing to do is to determine the cross sectional area and input the value into the convectional resistance formula/equation in order to determine the heat rate for the unfined package.
Thus, Area = (dimension of the electronic device) ^2. = (10 × 10^-6)^2 m.
Convectional Resistance = (100 × 10^-9)÷ (10 × 10^-6)^2 × 490 = 2.04 K/W.
Heat transfer coefficient = 1/ (10 × 10^-7)^2 × 10^5. = 1 × 10^5 K/W.
Thus, the heat rate for the unfined package = 2{(85 - 20) ÷ (10^5 + 2.04)} = 1.30 × 10^-3 W.
STEP TWO: Determine the surface area of each fin and the prime area.
Surface area of each fin = {300 + 15/4} × 10^-9 × 10^-9 × π × 15 = 1.43 × 10^-14 m^2.
Prime area = (10^-6 × 10)^2 - (200 × 200) × π × [ ( 15 × 10^-9)^2 ÷ 4] = 9.29 × 10^-11 m^2.
STEP THREE: Determine the efficiency
G ={ [300 + 15/4) × 10^9 } × [ 4 × 10^5÷ 490 × 15 × 10^-9] = 7.09 × 10^-2.
Efficiency= tanh ( 7.09 × 10^-2) ÷ 7.09 × 10^-2 = 0.998.
Thus, the coefficient = 1 - (1.43 × 10^-14 × (200 × 200) ÷ (6.65 × 10^-10) × (1 - 0.998) = 0.99.
STEP FOUR: Determine the heat rate for the finned package.
Thermal resistance = 1/ (10^5 × 0.999 × 10^-10 × 6.65 = 1.50 × 10^4 K/W.
The heat rate for the finned package = 2 { 85 - 20} ÷ { 1.50 × 10^4 + 2.04} = 8.64 × 10^-3 W
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